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Electrical Testing:
- Current-voltage-power (I-V-P) testing setup for fuel cells, sensors, and batteries.
- Electrical testing in various gases and fuels (Air, O2, H2, N2, CO, CO2, H2O, CH4) with various impurities (H2S, PH4, HCl)
- Automated 4-probe conductivity and Seeback coefficient stands for testing at various temperatures and pO2 levels
- PEM single-cell and three-cell stack testing (ElectroChem MTS-150 PEM electrical loads with HSA humidity control)
- Fuel cell planar test stands for large area cells (30-100 cm2 active area)
- Solartron 1260 and 1287 impedance/gain-phase analyzer with potentiostat
- Digital multi-meters (Keithley 2000)
- DC power supplies and loads (BK Precision)
- Probe Stations (Rucker and Coles models 680, 666, 660 and 260)
- Uniaxial mechanical testing systems (MTS Material Test System 810, Instron 3365)
Related Materials Synthesis and Processing*:
- NanoInk’s NLP 2000 Dip-Pen Nanolithography (DPN) system
- Brookfield DV-II+Pro Viscometer
- High-temperature furnaces (air and controlled-atmosphere <1700°C)
- Tapecaster (Mistler) and screenprinter (DEK)
- Computer-controlled laser cutter (Universal Laser Systems)
- Precision CNC dicing saw
- 75 ton four-post heated platen uniaxial press (PHI)
- Powder mills (roll and attrition mills)
- Nanopowder autoclave reactor (Autoclave Engineers 300EZ)
- Class 100, 1000, and 10,000 cleanrooms with photo- and e-beam lithography capabilities
- Controlled-atmosphere glove box (Vacuum Atmosphere Company)
- Vacuum/atmosphere controlled spin coater (Specialty Coating Systems P6700)
- BET (Micromeritics ASAP 2020)
- Laser particle sizer (Malvern Mastersizer 2000S)
- Nanopowder sizer (Malvern Zetasizer Nano-ZS)
- Rheometer (Brookfield DV-III Ultra)
- Intrusion Mercury Porosimeter (Micromeritics Autopor IV)
- ULPA laminar flow hoods (ESCO)
- Rotavapor system (Buchi R-205)
- Electron beam evaporator (BOC Temescal BJD-2000)
- Sputtering station (CVC 610)
- PECVD (Oxford 80+ Ionfab)
- LPCVD furnace (Tystar Mini-Tytan)
- Wedge-wedge and ball-wedge bonder (West Bond 747677E)
Related Microscopy and Spectroscopy Capabilities*:
- X-ray Photoelectron spectroscopy (XPS- PHl 5000 VersaProbeTM)
- Multifunctional scanning probe microscopy (PicoSPM® II)
- Fourier Transform Infrared Spectroscopy (FTIR) with UMA 600 Microscope (DIGLAB FTS7000)
- UV-V spectrometer equipped with the integration spheres accessory (Shimadzu 2550)
- 3-D Hi-Scope Microscope (enables 360 degree dynamic rotation with oblique viewing)
- Optical Microscope coupled with CCD camera (Leitz)
- Atomic Force Microscopy (AFM)- (tapping, conductive, and electrochemical)
- Electrostatic force microscopy (EFM)
- Magnetic force microscopy (MFM)
- Scanning tunneling microscopy (STM)
- X-ray Diffractometer (XRD) (Bruker D8 Unit with heated stage)
- JEOL 7600F Scanning Electron Microscope (SEM)/Oxford EDS and NPGS E-beam lithography software
- Hitachi S4700 FE-Scanning Electron Microscope (SEM)/EDAX Energy dispersive X-ray Detector (EDX)
- TEM sample preparation equipments including Model 1010 Ion-Mill from Fischione, MultiPrep™ System for semi-automatic polishing from Allied Hightech, TechCut 4™ Low Speed Saw from Allied Hightech, AxioImage light microscope with digital imaging from Zeiss, and Stereo Microscope.
- JEOL JEM-2100 High Resolution Transmission Electron Microscope (HRTEM) (will be installed in September 2009), point-to-point resolution of 0.23nm, high tilting capabilities, CCD camera digital imaging for electron diffraction, diffraction contrast and HRTEM imaging.
* Some Equipment available through WVNano user facility |
